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  • Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process 2018-12-19
  • Sanan IC Announces Commercial Release of 6-Inch SiC Wafer Foundry Process

    SUNNYVALE, Calif., Dec. 19, 2018 (GLOBE NEWSWIRE) -- SANAN INTEGRATED CIRCUIT CO., LTD. (Sanan IC), a pure-play wafer foundry with its advanced compound semiconductor technology platform, today announced that it has achieved full process qualification for commercial release of its 6-inch silicon carbide (SiC) technology to add to its foundry services portfolio. Committed to providing advanced materials manufacturing capability for serving the global market, the company now offers SiC technology which has emerged as the most mature wide bandgap (WBG) semiconductor intended for circuit designs in power electronics. With the ability to ensure its supply chain, the company provides a dedicated capacity for its 6-inch SiC wafer processing services on top of its III-V compound manufacturing, namely for gallium arsenide (GaAs), gallium nitride (GaN), and indium phosphide (InP).

    “We are delighted to expand our wafer foundry services to now include SiC and make it commercially available to the wide bandgap semiconductor market world-wide”, said Raymond Cai, Chief Executive Officer of Sanan IC. “We see tremendous business opportunities in serving the high growth power electronics market with SiC displacing silicon solutions due to its higher efficiency, higher switching frequency, and higher temperature characteristics. The enormous growth of the automotive, big data, renewable clean energy, and power utility industries has created opportunities for us to offer SiC foundry services to the global market. Leveraging our state-of-the-art manufacturing plants, robust supply chain, and worldwide team of industry veterans makes Sanan IC the ideal foundry partner”.

    Sanan IC’s SiC process technology offers device structures for 650V, 1200V and higher-rated Schottky Barrier Diodes (SBD), to soon be followed by a SiC MOSFET process for 900V, 1200V, and higher. SiC SBDs and SiC MOSFETs, due to higher performance, are emerging for power conversion applications starting from 650V. Given the superior properties of SiC over silicon in terms of higher efficiency, increased power density, higher switching frequency, higher temperature, higher breakdown strength, more compact and lighter system design, several applications have started to embrace this technology.

    The adoption of SiC has accelerated into multiple markets such as in photovoltaic solar cells, industrial motor drives, power factor correction (PFC) for enterprise server, telecom base station power supplies. In electric vehicles (EV) and hybrids (HEV), SiC is widely used on the on-board charger (OBC), power train inverters, and DC/DC converters.  According to Yole Développement (Yole), a leading technology market research firm, part of Yole Group of Companies, the SiC power device semiconductor market is forecasted to have a value over $1.5B by 2023 with a compound annual growth rate (CAGR) of 31% from 2017 to 20231. Sanan IC is poised to meet the customers’ demands for quality, volume, ramp, and reliability.

    Sources:
    1Power SiC 2018: Materials, Devices, and Applications Report, Yole Développement (Yole), July 2018

    About Sanan IC

    Sanan Integrated Circuit Co., Ltd. (Sanan IC) is China’s first 6-inch compound semiconductor wafer foundry, serving the microelectronics and photonics markets worldwide. The company was founded in 2014, and is based in Xiamen City in the Fujian Province of  China, operating as a subsidiary of Sanan Optoelectronics Co., Ltd. (SSE: 600703). The company develops and provides GaAs, GaN, SiC, and InP foundry services with its state-of-the-art III-V compound semiconductor fabrication facilities. Certified to the ISO9001 international quality standard and ISO14001 environmental management standard, Sanan IC empowers the global community of RF, millimeter wave, filter, power electronics, and optical communications markets with its advanced process technology platform. Sanan IC is Dedicated to Drive Compound Semiconductor Innovation. www.sanan-ic.com/en.

    Media Relations Contact
    Raymond Biagan
    ray@sanan-ic.com

  • Committed to Quality and Security: Sanan IC Achieves Management System Certifications 2018-11-27
  • Committed to Quality and Security: Sanan IC Achieves Management System Certifications
     Sunnyvale, Calif. – November 27, 2018– SANAN INTEGRATED CIRCUIT CO., LTD. (Sanan IC), a pure-play compound semiconductor foundry with its advanced III-V technology platform, today announced that it has attained additional certifications for its manufacturing management systems. The company recently earned IATF16949:2016 Automotive Quality Management System (QMS) certification, and this past June also completed ISO27001:2013 certification for Information Security Management standards compliance. These recent achievements are in addition to existing certifications which include ISO9001:2015 Quality Management and Assurance Systems, IECQ QC080000:2012 Hazardous Substance Process Management (HSPM), ISO140001:2015 Environmental Management Systems (EMS), and OHSAS 18001:2007 Occupational Health and Safety Management.
     
    “We at Sanan IC are proud of having attained these key milestones of international standards compliance for Quality, Environmental and Information Technology (IT) management systems”, said Raymond Cai, Chief Executive Officer of Sanan IC. “Having these procedures and disciplines in place not only gives us a solid foundation to be a world-class, large-scale wafer manufacturer, but it also shows our company’s commitment to quality, security, and safety which our customers demand and which our employees expect. These management systems definitely helps us strive for constant improvements in efficiency, productivity, communications, and environmental awareness”.
     
    Sanan IC offers a broad portfolio of compound semiconductor wafer foundry services, namely for gallium arsenide (GaAs) HBT, pHEMT, BiHEMT, integrated passive device (IPD), filters, gallium nitride (GaN) power HEMT, silicon carbide (SiC), and indium phosphide (InP) intended for RF, millimeter wave, power electronics, and optical communications markets. Among the various applications for these process technologies is automotive such as for vehicle-to-everything (V2X) communications, collision-avoidance sensors, hybrid/electric vehicle (HEV/EV) charging and motor drives. With IATF 1694 compliance, Sanan IC’s customers are able to meet the automotive industry’s stringent quality system requirements.
     
    To mitigate information and intellectual property (IP) protection concerns, ISO27001 compliance facilitates best-practice for aninformation security management system (ISMS). It sets guidelines for implementing and monitoring security measures as well as for risk management of both the company’s and customers’ proprietary information and IP. Practicing and maintaining these security management procedures combined with the other quality and environmental systems lead to building and establishing customer confidence and trust.
     
    About Sanan IC
    Sanan Integrated Circuit Co., Ltd. (Sanan IC) is China’s first 6-inch compound semiconductor wafer foundry, serving the microelectronics and photonics markets worldwide. The company was founded in 2014, and is based in Xiamen City in the Fujian Province of  China, operating as a subsidiary of Sanan Optoelectronics Co., Ltd. (SSE: 600703). The company develops and provides GaAs, GaN, SiC, and InP epitaxial wafers and substrates with its state-of-the-art III-V semiconductor fabrication facilities. Sanan IC empowers the global community of RF, millimeter wave, filter, power electronics, and optical communications markets with its advanced process technology platform. www.sanan-ic.com/en.
     
    Media Relations Contact
    Raymond Biagan
    ray@sanan-ic.com
  • VCSEL developments will leverage III-V manufacturing know-how and serve large scale markets - Interview of Sanan IC 2018-10-31
  • VCSEL developments will leverage III-V manufacturing know-how and serve large scale markets - Interview of Sanan IC

    Driven by the development of data communications and the boom of Internet’s popularity, the sweet spot of Vertical Cavity Surface Emitting Lasers (VCSELs) has evolved. It has been, until recently, in short-distance data communication, but in the last few years, with the development of the latest generation of smartphones, VCSELs have made their way into high volume consumer applications. Automotive applications, such as Light Detection and Ranging (LiDAR) and gesture recognition, are expected to follow.

    VCSEL related patent activity began in the late ‘80s, but since 2010, the decreasing IP activity related to Datacom has been balanced by the emergence of new applications like LiDAR and 3D sensing. This made the VCSEL market explode in 2017, propelling overall revenue to ~$330M, expected to reach ~$3,500M by 2023.

    In its latest report, VCSELs – Technology, Industry and Market Trends, Yole Développement offers a comprehensive analysis of the main VCSEL applications, including in-depth analysis of the consumer and automotive landscapes. This is complemented now by the VCSEL patent landscape analysis realized by KnowMade, providing a comprehensive analysis of patents related to promising technologies and main players’ IP portfolios.

    Pierrick Boulay, Technology & Market Analyst, Solid-State Lighting at Yole and Paul Leclaire, Patent & Technology Analyst at KnowMade had the opportunity to discuss with Jimmy Cheng, Head of Optical Devices (OD) Business Unit at San'an Integrated Circuit (Sanan IC). During this interview, they exchanged ideas and thoughts about the VCSELs industry, Sanan IC activities in this sector and the added-value of its technologies. Read on for their full discussion below.

    Pierrick Boulay (PB): What is the history of VCSEL development at Sanan IC?

    Jimmy Cheng (JC): With Sanan Optoelectronics, the market leader in high volume GaAs- and GaN-based LED-chip manufacturing, being our parent company, Sanan IC was founded to leverage III-V manufacturing know-how and experience to serve other large-scale vertical markets such as optical, RF, and power electronics. With in-house III-V technology platform capability, including for InP and GaAs for optical, as well as packaging, we at Sanan IC naturally see VCSELs as a key component together with other initiatives within our Optical Devices business unit, where we can leverage our capability in high volume compound semiconductor manufacturing.

     a typical high power VCSEL array interview yole



    A typical high-speed single VCSEL and a typical high-power VCSEL Array
    (Source: San'an-IC)

     PB: What is the point of differentiation of Sanan IC for VCSELs?

    JC: We offer dedicated high volume 6” GaAs and 2”/4” InP compound semiconductor manufacturing lines for optical devices and foundry services, including VCSELs, to meet large scale, rapid ramp-up market demands.

    PB: What is the next step by Sanan IC for VCSEL?

    JC: Based on current market demands for emerging VCSEL applications, such as facial/gesture recognition, consumer 3D sensing, optical communications, cloud services, etc., Sanan IC is positioned to offer customers who need compound foundry services and customized optical products and components total solutions to meet their market needs.

    Paul Leclaire: In the last 10 years we have seen many IP players from the datacom or laser printing domain enlarging their IP portfolio by filing patents related to 3D sensing including LiDAR and consumer, or other new applications. Do you think that they can take advantage of their background in the VCSEL manufacturing for datacom, etc. to penetrate and dominate the automotive or consumer market?

    JC: We certainly recognize both markets as being viable and active today for VCSELs. We do have plans to serve the consumer space for proximity sensing, facial/gesture recognition, and 3D sensing which can then expand into larger arrays for illumination, projection, and higher resolution recognition. Such devices can be leveraged for LiDAR and other sensing applications for automotive with the required standards compliance.

    PB: How have VCSELs evolved in the last 10 years and what can we expect in the next 10 years: package, price, performance and manufacturing?

    JC: VCSEL-based multimode optical transceivers have been dominated by VCSEL applications for Datacom in the past, led by Broadcom (Avago), Finisar (ex-Honeywell) and Lumentum. However, due to the increasing data rate requirements, the trade-off is that the link distance is becoming shorter.

    The overall demand for Datacom applications will decrease slowly. In terms of price, 10Gb/s pricing has come down to the floor due to both maturity of the end-product and volume. As for data rates of 25Gb/s and higher, the demand is higher than the supply, therefore pricing is on the high side, but we foresee it coming down at a faster pace in the next 3-5 years once additional players enter into this space. For cost-effectiveness, chip-on-board is the most common packaging used for this type of application.

    As for consumer applications, the scale of market demand is much greater (~100x). In the past, the demand for data-heavy applications was limited, but there are a number of areas which have recently captured consumer’s attention, such as face/gesture recognition, proximity sensing, LiDAR, cosmetic, biosensor, etc. New applications continue to emerge which are being studied and developed daily. Pricing is definitely the key factor for gaining more market penetration. The barrier to entry is slightly lower, but there are still only a few suppliers who are capable of supporting high volume manufacturing with high product quality. Sanan IC is one of them, and is well positioned to offer the optimum combination of cost and performance to the market as applications and market demand grows in the next 10 years.


     

    (Source: VCSELs - Technology, Industry and Market Trends, Yole Développement, July 2018)

     PB: According to you, what are the main challenges related to the VCSEL manufacturing process and how to overcome them?

    JC: The design and growth techniques of epi wafer structures are critical factors to produce high quality VCSEL products. We see the need for yield improvements, in particular in 6”, to be key. As VCSELs scale into larger sized chips from 3D sensing to LiDAR, handling thermal (heat) dissipation and heat sink issues are also important. We’ve been able to achieve high precision control of 6” epi wafer uniformity, of wet oxidation uniformity, of near-field pattern (NFP), and of intensity distributions for emitters/cavities on the chip. Volume production also requires large scale testing capability and a Quality Control (QC) infrastructure, both of which we have put in place.

    PB: Could you please detail the key differences between VCSELs for Datacom and VCSELs for 3D sensing applications, including consumer and automotive?

    JC: The key differences among these applications are reliability requirements, operating conditions and output power. Datacom is pushing for higher bandwidths and narrower spectrum width. On the other hand, consumer is pushing for better conversion efficiency (CE) with less driving current and less heat generation. Since most consumer applications require multiple emitters with larger die size, 6” wafers will be more cost-effective for large-scale mass production. However, this also requires tighter control of process uniformity to gain better production yield at the die level.

     PB: Apple has started the use of VCSEL for 3D sensing. What do you expect from other Android players?

    JC: From past experience and from what we’ve seen in the market, Android players usually implement similar technologies to those adopted by Apple within a span of 1.5 years. However, we have already seen some major mobile phone players offering similar features this year which is sooner than we have seen previously. The supply of VCSEL in the market is still very limited. What’s important is the cost of the module itself (packaged VCSEL with optics) and market reception. The current technology is only featured by flagship phones. To grow the market further, the module price needs to come down to get into the lower tier smartphones.

    PB: Today, 3D sensing is only available on the front of smartphones (except Lenovo and Asus). According to you, will we see a 3D module at the rear of smartphone in a near future? What will be the typical use case? What are the challenges / requirements compared to front 3D sensing?

    JC: We think this will be among the next generation feature sets to be offered by mobile phone makers. This will expand the applications into AR/VR which will motivate more users to pay for premium models.

    PB: 3D sensing is today the main application of VCSEL in smartphones but gas sensing and air quality monitoring can also be done with VCSELs. When do you expect it to be integrated into smartphones? What will be the added value of such a feature in smartphones?

    JC: As IOT concepts are widely discussed, different solutions have been offered. We do not see a need to add more sensing features in itself. With available IOT solutions, smartphones can connect with remote sensors and read the signal easily through wireless connectivity (Bluetooth, WiFi, NFC, cellular...). Adding more sensing features will limit the space for the screen and board, and make designs more difficult.

     Interviewee:

    Man Cheng circle interview yole 2018Jimmy Cheng is the head of our Optical Devices (OD) Business Unit at Sanan IC, which covers our VCSEL, photodiodes/detector, and laser initiatives. Jimmy oversees the Business Unit’s engineering, technology development, and marketing of our GaAs- and InP-based optical devices, intended to serve high-volume verticals, namely consumer, communications (datacom/telecom), and industrial.

     

     

    Interviewers:

    PierrickBoulay YOLE2015 Pro BD round

    As part of the Photonics, Sensing & Display division at Yole Développement (Yole), Pierrick Boulay works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in R&D department for LED lighting applications. Pierrick holds a master degree in Electronics (ESEO - France).

     

    PLE Pro GreyBackground BW 2017 bd

    Dr. Paul Leclaire works for Knowmade in the fields of RF technologies, Wireless communications and MEMS sensors. He holds a PhD in Micro and Nanotechnology from the University of Lille (France), in partnership with IEMN in Villeneuve-d'Ascq and CRHEA-CNRS in Sophia-Antipolis (France). Paul previously worked in innovation strategy consulting firm as Consultant.






    Source : https://www.i-micronews.com/compound-semi-expertise/12487-interview-sanan-2.html

  • Sanan IC Goes Global, Emerges As a World-Class III-V Technology Platform Company 2018-08-22
  • Sanan IC Goes Global, Emerges As a World-Class III-V Technology Platform Company
    SUNNYVALE, Calif., Aug. 22, 2018 (GLOBE NEWSWIRE) -- SANAN INTEGRATED CIRCUIT CO., LTD. (Sanan IC), a pure-play compound semiconductor foundry, today announces its entry into the North American, European, and Asia Pacific (APAC) markets with their advanced III-V technology platform. With their broad portfolio of gallium arsenide (GaAs) HBT, pHEMT, BiHEMT, integrated passive device (IPD), filters, gallium nitride (GaN) power HEMT, silicon carbide (SiC), and indium phosphide (InP) DHBT process technologies, they cover a wide range of applications among today’s active microelectronics and photonics markets. Sanan IC is strongly focused on high performance, large scale, and high quality III-V semiconductor  anufacturing and on serving the RF, millimeter wave, power electronics, and optical markets.

    Founded in 2014, head quartered in Xiamen City, in the Fujian province of south China, Sanan IC is subsidiary of Sanan Optoelectronics Co., Ltd., the leading LED chip manufacturing company, based on GaN and GaAs technologies. Leveraging high volume production and years of investment in numerous epitaxial wafer reactors of its parent company for the LED lighting and solar photovoltaic markets, Sanan IC is expanding their go-to-market strategy beyond the Greater China region as their process technologies and patent portfolio mature, with a vision to fulfill the needs of independent design manufacturers (IDM’s) and fabless design houses for high volume compound semiconductor fabrication.

    “We see tremendous opportunity in serving the world-wide demand for large scale production of 6-inch III-V epitaxial wafers, driven by continual growth of the RF, millimeter wave, power electronics, and optical markets,” said Raymond Cai, Chief Executive Officer of Sanan IC. “Our vertically integrated manufacturing services over our broad compound semiconductor technology platform, with in-house epitaxy and substrate capabilities, make us an ideal foundry partner. Given the capital investments made on state-of-the art equipment and facilities, with full support from our parent company, Sanan Optoelectronics, combined with strategic partnerships, and a world-class team of scientists and technologists, Sanan IC is well positioned for success in this active compound semiconductor market”.

    As cellular mobility and wireless connectivity proliferates in the Internet-of-Things (IoT), and 5G sub-6GHz evolves into millimeter wave, III-V technologies become even more critical to support the infrastructure and client device deployments by carriers worldwide. According to Yole Développement (Yole), a leading technology market research firm, part of Yole Group of Companies, the GaAs wafer market, comprised of RF, photonics, photovoltaics, and LEDs, is expected to grow to over 4 million units in 2023, with photonics having the highest growth at 37% CAGR1. GaN and SiC for power electronics, such as for data centers, electric vehicles (EVs), battery chargers, power supplies, LiDAR, and audio, are predicted to ramp up, with GaN reaching up to $460M shipments by 2022 with a CAGR of 79%2 while SiC projects to reach $1.4B at 29% CAGR by 20233. Optical components continue to be in high demand for datacom, telecom, consumer, automotive and industrial markets, leading to increased revenues for photodectors, laser diodes, and especially VCSELs with expected shipments of $3.5B in 20234. As these applications emerge, Sanan IC is poised to support the industry's needs.

    Sources:
    1 GaAs Wafer & Epiwafer Market: RF, Photonics, LED & PV Applications Report, Yole Développement (Yole), 2018
    2,3 Power SiC 2018: Materials, Devices and Applications Report, Yole Développement (Yole), 2018
    4 Source: VCSELs – Technology, Industry & Market Trends report, Yole Développement (Yole), 2018


    About Sanan IC
    Sanan Integrated Circuit Co., Ltd. (Sanan IC) is China’s first 6-inch compound semiconductor wafer foundry, serving the microelectronics
    and photonics markets worldwide The company was founded in 2014, and is based in Xiamen City in the Fujian Province of China,
    operating as a subsidiary of Sanan Optoelectronics Co., Ltd. (SSE: 600703). The company develops its own GaAs, GaN epitaxial wafers
    and substrates with its state-of-the-art III-V semiconductor fabrication facilities. Sanan IC empowers the global community of RF, millimeter wave, filter, power electronics, and optical components and sub-systems industries with its advanced process technology platform.
    www.sanan-ic.com/en.

    Media Relations Contact
    Raymond Biagan
    ray@sanan-ic.com