Global smartphone shipments fluctuate around 1.2 billion units annually, driving a dozen-billion-dollar RFFE market. With the evolution of communication standards and RFFE architectures, market vitality will further intensify. The gradual introduction of 5G-A/6G standards and in-depth development of spectrum resources have brought more complex system requirements, including demands for MIMO UL/DL support, increasing CA combinations, and more coexistence scenarios to manage. The activation of non-terrestrial networking and topology expansion will also perfect the integrated air-space-terrestrial wireless communication network. Once RFFE devices iterate to meet these challenges, we can almost stay connected worldwide from anywhere on Earth via a simple smartphone in hand.
Compound semiconductors play a key role in addressing these challenges. GaAs PA modules remain the core of RFFE systems, while LT SAW filters have become increasingly critical due to higher demand in modules and technological advancements.
The Phase 8 solution is a new 5G RFFE solution that MTK initiated defining in collaboration with device manufacturers and terminal vendors since 2021. The Phase series helps wireless communication professionals quickly define development directions, achieve standardized design and production, rapidly facilitate device deployment, and reduce operation and maintenance costs.
Aiming at 5G application scenarios, Phase 8 re-architects chip solutions to eliminate redundant performance. Among them, Phase 8L adopts a breakthrough All-in-One solution: a single L-PAMiD module covers the full frequency band requirements of Sub-3GHz, achieving a harmonious balance between performance and cost.
Satellite connectivity, a well-known form of non-terrestrial communication (NTN), has been implemented in many high-end smartphones. It effectively complements the coverage limitations of terrestrial 5G networks, particularly in remote areas and at sea. In the IoT domain, it also provides wide-area coverage and low-power connection solutions.
Satellite connectivity demands higher transmission power from terminals, requiring support for conducted output levels of 30 dBm or even higher. Conversely, satellite signals received by terminals experience significant losses, necessitating more advanced device designs at the receiving end to improve the system's signal-to-noise ratio. As satellite deployments gradually completed, the coverage of network will undergo comprehensive upgrades, ultimately realizing an integrated air-space-terrestrial network.
With specialization in compound semiconductor development and technology iteration for RFFE chips, we pursue the highest possible performance and efficiency in RF devices and modules.
Bridging RF PA, filters & advanced packaging to support your most complex RF system challenges.
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